http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101759400-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F2301-255 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F2301-10 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3484 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F9-16 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F9-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-02 |
| filingDate | 2015-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101759400-B1 |
| titleOfInvention | A silver coating method for copper powder used circuit printing and adhesive conductive paste |
| abstract | The present invention relates to a silver (Ag) coating method for copper powder applicable to circuit printing and conductive adhesive paste, more specifically, to silver powder coated with silver using sodium potassium tartrate and ascorbic acid, To a silver coating method of copper powder having conductivity. That is, the present invention relates to a method for preparing a solution 1 by dissolving silver salt and ammonia water in a first step; A second step of dissolving a surface active agent and a reducing agent in distilled water to prepare solution 2; A third step of removing foreign substances from the surface of the copper powder and surface activation by adding copper powder to the solution 2; A fourth step of depositing the solution 1 in the solution 2 to precipitate silver on the surface of copper to coat silver; And a fifth step of washing the silver-coated copper powder of the fourth step with distilled water and then vacuum drying the silver-coated copper powder. The silver coating method of the present invention is applicable to circuit printing and conductive adhesive pastes . |
| priorityDate | 2015-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.