http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101757742-B1

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06716
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06738
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R3-00
filingDate 2010-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101757742-B1
titleOfInvention Probe and Probe Manufacturing Method
abstract A probe and a method for manufacturing the probe are disclosed. The probe of the present invention forms a solder layer in advance in the probe main body that supports the tip portion. When the probe is bonded onto the circuit board, the solder layer is melted and the probe and the circuit board are bonded. The probe of the present invention may have a bottom surface of the probe main body formed in a concavo-convex shape so that the bonding strength of the solder can be increased by accommodating the solder during the bonding process. Such a probe is bonded not only on the outer side but also on the inner groove, so that it can have a high adhesive strength while adhering in a bonding pad narrower than the case where the probe is merely adhered to the outside or the bottom.
priorityDate 2010-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689

Total number of triples: 18.