http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101755018-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0273 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0755 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0758 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2013-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101755018-B1 |
| titleOfInvention | Photo-curable and thermo-curable resin composition and dry film solder resist |
| abstract | The present invention relates to a resin composition comprising an acid-modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, an inorganic filler, a silicone epoxy copolymer and an organic solvent, wherein the content of the inorganic filler in the solid content excluding the organic solvent is 20 wt% %, Photocurable and thermosetting, a dry film solder resist obtained from the resin composition, and a circuit board comprising the dry film solder resist. |
| priorityDate | 2013-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 194.