| abstract |
The present invention discloses a resin composition comprising a modified polyphenyl ether resin and an organosilicon compound containing an unsaturated double bond. The present invention also discloses a method of manufacturing a high-frequency circuit board using the resin composition as described above and a high-frequency circuit board manufactured by the method. The high frequency circuit board according to the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlaminar adhesive strength, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit board of a high frequency electronic device. |