| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_48d7b2109b2c2707f5498af7c44d645c |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-65 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 |
| filingDate |
2016-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_695dd82456e3f4f772a984354aac1068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5615d34ddff89a2de4ca6f9d087342b4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0687011f9590ccf89ce54f549d66bc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84faa48d3055c535e86019e4767e59fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d0b2dd854d9e0ff9497e47f22298892
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7745b12e7bbee542292c5bd5223274ae |
| publicationDate |
2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101751972-B1 |
| titleOfInvention |
FOD adhesive film of semiconductor controller embedding type and Semiconductor package |
| abstract |
The present invention relates to a controller die-embedded type adhesive film applied to a semiconductor package of a film on die (FOD) type and a semiconductor package using the same. More specifically, the present invention embeds the controller die effectively to suppress voids To a controller die-embedded type adhesive film capable of improving reliability and minimizing the amount of an adhesive layer flowing out to the outside, thereby facilitating wire bonding without contamination of the adhesive layer, and a semiconductor package using the same. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11699685-B2 |
| priorityDate |
2016-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |