http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101751541-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06 |
| filingDate | 2010-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101751541-B1 |
| titleOfInvention | Composition for encapsulating optical semiconductor element |
| abstract | The present invention further improves a composition comprising an epoxy-modified silicone resin having a predetermined linear polysiloxane structure in terms of thermal shock resistance and available time. The composition for sealing an optical semiconductor device of the present invention is a branched silicone resin produced by the addition reaction of (A) an unsaturated group-containing epoxy compound with an organopolysiloxane having SiH groups, wherein at least three epoxy groups per molecule, (B) a non-aromatic epoxy resin (A) having two or more epoxy groups per molecule, and (B) a non-aromatic epoxy resin having at least two epoxy groups per molecule, (A) and (B) is from 0.4 to 1.5 moles per mole of the total of 1 mole of the epoxy groups of the curing agents (A) and (B), (D) And 0.01 to 3 parts by mass based on 100 parts by mass of the total of the components (A) to (C). |
| priorityDate | 2009-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.