| abstract |
The present invention relates to a high heat resistant and low dielectric polysilsesquioxane resin composition applicable to a liquid crystal display, an OLED, a touch panel, an electronic paper, a flexible display and the like, and a black resist composition for light shielding comprising the same. More specifically, the present invention relates to a resin composition comprising: 1) a polysilsesquioxane random copolymer resin composition containing a polar heterocyclic structure and being curable with ultraviolet rays; 2) a carbon black dispersion liquid which is dispersed and coated with the polysilsesquioxane resin; 3) a black heat-resistant black resist composition having a high heat resistance and a low dielectric constant, including a photoinitiator. Compared with conventional acrylic or cadmium black resists, the black resist resin composition of the present invention is excellent in heat resistance even after a high temperature process of 350 DEG C or higher, has no optical density (OD) drop, and can satisfy low dielectric properties at the same time. |