| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K31-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
2012-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101749357-B1 |
| titleOfInvention |
Paste for jointing and method for jointing semiconductor device and substrate |
| abstract |
The bonding paste contains (A) metal nanoparticles having an average particle size of 100 nm or less, (B) a solvent having a boiling point of 50 to 100 캜, (C) a solvent having a boiling point of 150 to 200 캜, (B) is 10 to 30 parts by mass based on 100 parts by mass of the total of the component (B) and the component (C). The bonding method of the semiconductor element and the substrate includes a step of applying the bonding paste on the substrate and drying the bonding paste and a step of placing the semiconductor element on the dried bonding paste and heating the bonding paste . |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3778075-A4 |
| priorityDate |
2011-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |