http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101748004-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10128 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate | 2014-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101748004-B1 |
| titleOfInvention | Anisotropic conducting film |
| abstract | The present invention relates to an anisotropic conductive film comprising an insulating layer, a conductive layer laminated on the insulating layer and containing conductive particles, wherein a lowest melt viscosity of the conductive layer is larger than a lowest melt viscosity of the insulating layer . The anisotropic conductive film of the present invention can be configured to include a conductive layer having a lowest melt viscosity and an insulating layer having a lowest melting point so that shorting between the conductive particles can be prevented, connection resistance can be lowered, And by including insulating particles, it is possible to provide a sufficient adhesion force between the circuit members, and the recognition performance is greatly improved. |
| priorityDate | 2010-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 150.