http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101745731-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate | 2009-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101745731-B1 |
| titleOfInvention | Electrodeposition of copper in microelectronics with dipyridyl-based levelers |
| abstract | A semiconductor integrated circuit including a front surface, a back surface, and a via feature, wherein the via feature includes an opening in the front surface of the substrate, a side wall extending inwardly from the front surface of the substrate, A method for metallizing a via feature of a circuit device substrate. The method comprises contacting a semiconductor integrated circuit device substrate with an electrolytic copper deposition chemistry comprising: (a) a source of copper ions; and (b) a leveler compound that is a reaction product of a dipyridyl compound and an alkylating agent; And depositing a copper metal on the bottom and sidewalls of the via feature by applying an electrical current to the electrolytic deposition chemistry to yield a copper filled via characteristic. |
| priorityDate | 2008-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 186.