http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101739410-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D233-60 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D233-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2011-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101739410-B1 |
| titleOfInvention | Plating bath and method |
| abstract | There is provided a copper plating bath containing a leveling agent which is a reaction product of a specific imidazole and a specific epoxide-containing compound, and depositing copper on the surface of the conductive layer. This plating bath deposits a substantially planar copper layer on the substrate surface over a range of electrolyte concentrations. A method of depositing a copper layer using such a copper plating bath is also provided. |
| priorityDate | 2010-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 97.