http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101738535-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32 |
| filingDate | 2015-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101738535-B1 |
| titleOfInvention | Tin-based electroplating solution for solder bump |
| abstract | An amount of tin methanesulfonate that results in a concentration of 40 to 105 g / L on a tin basis; As an optional component, the amount of methanesulfonic acid to give a concentration of 0.40 to 3.0 g / L based on silver and 130 to 350 g / L of complexing agent; 70 to 210 g / L methanesulfonic acid; 0.1 to 500 g / L of antioxidant; 0.5 to 60 g / L of additives; And a tin-based electroplating solution for solder bumps containing water. |
| priorityDate | 2015-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.