http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101737501-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
| filingDate | 2010-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101737501-B1 |
| titleOfInvention | Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath |
| abstract | The present invention relates to an electroplating bath and an electroplating method using the electroplating bath. The electroplating process is excellent in adhesion to a through hole with respect to a substrate in which a through hole and a via hole are mixed, An object of the present invention is to provide such a good electroplating bath and an electroplating method using the electroplating bath. The present invention relates to a process for producing polylactic acid, which is produced by heat-treating an epichlorohydrine modification product of a polycondensate comprising a water-soluble copper salt, sulfuric acid, and a chloride ion as main constituents and diethylene triamine, adipic acid and epsilon -caprolactam, Amide polyamine as a leveling agent. |
| priorityDate | 2009-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.