| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4f8aee761197408a2b2946efa9e16f69 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D2585-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2553-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-21 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M1-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D65-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D73-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D65-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M1-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08 |
| filingDate |
2016-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f016c2f7f08736c08c4c31beb0701bdc |
| publicationDate |
2017-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101736676-B1 |
| titleOfInvention |
Cover tape for packaging electronic parts and method for preparing the same |
| abstract |
The present invention relates to a base film; A first antistatic layer formed on one surface of the base film; A buffer layer sequentially laminated on the other surface of the base film; A heat seal layer; And a second antistatic layer, and having a surface resistance value of 1 x 10 5 Ω / □ to 1 × 10 8 Ω / □, and a manufacturing method thereof. The cover tape for packaging electronic parts of the present invention is excellent in antistatic effect and adhesiveness, and the composition for forming a heat seal layer does not contain a halogen component and is environmentally friendly, and its production method is gravure coating, Since the heat seal layer having a thickness of 5 to 15 mu m can be formed by coating, the processability and economical efficiency are excellent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230041181-A |
| priorityDate |
2016-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |