http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101736084-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D303-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D303-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D301-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D303-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D303-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D301-02 |
| filingDate | 2015-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101736084-B1 |
| titleOfInvention | Triphenyl-based epoxy compound having alkoxysilyl group and method for preparing the same, and composite of organic-inorganic materials comprising a cured product thereof and method for preparing the composite |
| abstract | TECHNICAL FIELD The present invention relates to a triphenyl-based epoxy compound having an alkoxysilyl group, a process for producing the same, and an organic-inorganic composite including the cured product and a process for producing the complex. More particularly, A novel triphenyl-based epoxy compound capable of providing a composite exhibiting improved heat resistance and thermal expansion characteristics when used in the manufacture of high-integration and high-performance electronic parts and having excellent curing property, a method for producing the same, and an organic- And a process for producing the complex. |
| priorityDate | 2015-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.