| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate |
2013-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101734425-B1 |
| titleOfInvention |
Preparation method for dry film solder resist and film laminate used therein |
| abstract |
The present invention relates to a dry film solder resist production method capable of forming a dry film solder resist having fine irregularities on its surface by a simpler method and a film laminate used therefor. The method for producing a dry film solder resist includes the steps of: forming a resin composition having a predetermined photo-curable property and a thermosetting property on a transparent carrier film having fine irregularities having an average roughness (Ra) of 200 nm to 2 탆 formed on its surface; Laminating the resin composition on a substrate to form a laminate structure in which a substrate, a resin composition and a transparent carrier film are sequentially formed; Exposing the resin composition to light, and peeling the transparent carrier film; And a step of alkali-developing the resin composition of the non-exposed portion and thermally curing the resin composition. |
| priorityDate |
2013-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |