http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101733059-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-421 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| filingDate | 2016-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101733059-B1 |
| titleOfInvention | Method of manufacturing engine control unit printed circuit board |
| abstract | It is an object of the present invention to provide a method of manufacturing an ECU printed circuit board for improving fuel efficiency and durability of automotive parts. In order to achieve the above object, a method of manufacturing an ECU printed circuit board according to the present invention includes a first step (S100) of preparing an epoxy layer (100) in which a copper foil (110) is laminated on both surfaces, A second step S200 of forming a through hole A and a component insertion hole B penetrating through the lower surface of the through hole A and the inner surface of the through hole A and the inner surface of the component insertion hole B, (S300) of forming an electroless copper plating layer (120) on the electroless copper plating layer (110) and forming an electroplated copper layer (130) on the electroless copper plating layer (120) A fourth step S400 of conducting hole plugging with a conductive paste ink 200 and a fourth step S400 of performing hole plugging with the conductive paste ink 200. The copper foil 110, (S500) of forming a predetermined circuit pattern by performing a circuit forming process on the conductive paste ink (200) and a through hole (A) A sixth step (S600) of printing a land and a predetermined area other than the center of the circuit with the solder resist ink 140; and a sixth step (S600) of printing the circuit, the hole of the component hole (B) Shaped first hole (C), a bottom surface of the first hole (C), and a lower surface of the epoxy layer (100) penetrate through a region of the epoxy layer (100) A solder resist ink 140 of the circuit is coated on the inner surface of the hole of the component hole B and the hole of the component hole B and the seventh step S700 of forming the second hole D And an eighth step (S800) of sequentially forming a nickel plating layer 150 and a gold plating layer 160 in a region where the gold plating layer 160 is not formed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101929952-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114958081-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101935247-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102155214-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101935248-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101864220-B1 |
| priorityDate | 2016-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.