http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101727353-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0058 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-6659 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 |
| filingDate | 2011-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101727353-B1 |
| titleOfInvention | Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer |
| abstract | The present invention relates to a polyurethane resin (a) having a carboxyl group and having an acid value of 100 to 1000 equivalent / 10 6 g, a number average molecular weight of 5.0 × 10 3 to 1.0 × 10 5 , and a glass transition temperature of 30 to 80 ° C. 1), a polyester resin (a-2) having a number average molecular weight of 5.0 x 10 3 to 1.0 x 10 5 and a glass transition temperature of 0 캜 or lower, an epoxy resin (b) containing a nitrogen atom, dicyclopentadiene Wherein the content of the polyurethane resin (a-1) relative to the total of the polyurethane resin (a-1) and the polyester resin (a-2) And the content of the entire epoxy resin contained in the resin composition relative to the total of the polyurethane resin (a-1) and the polyester resin (a-2) is 5 to 30 mass% ) Is 0.1 to 20 mass% of the entire epoxy resin contained in the resin composition The. |
| priorityDate | 2010-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 180.