| abstract |
The present invention relates to a method for electroless electroless plating (LDS), and a method for electroless plating of LDS according to the present invention, It is possible to simultaneously eliminate defective factors by only a single step pretreatment, thereby reducing defective rate, increasing product yield, improving productivity, and improving reliability and durability. Further, according to the present invention, it is possible to prevent the oxidation of metal particles that become seeds of plating in the manufacture of an intenna by the LDS electroless plating method, thereby preventing plating on unnecessary portions, Excellent in characteristics such as RF characteristics and resistance value, and also remarkably improved the economical efficiency of the process. |