http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101721818-B1

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filingDate 2009-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101721818-B1
titleOfInvention Aluminum-diamond composite and method for producing the same
abstract Provided is an aluminum-diamond-based composite having a high thermal conductivity and a thermal expansion coefficient close to that of a semiconductor device, and which is improved in plating properties and surface roughness of the surface so as to be suitable for use as a heat sink or the like of a semiconductor device. Wherein the aluminum-diamond-based composite comprises a complexing portion and a surface layer provided on both surfaces of the composite portion, wherein the surface layer comprises aluminum as a main component Wherein the content of the diamond particles is 40% by volume to 70% by volume of the entire aluminum-diamond-based composite.
priorityDate 2008-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 41.