http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101712185-B1

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filingDate 2016-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2017-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101712185-B1
titleOfInvention Forming Method for Conductive pattern using for intense pulsed light-sintering and conductive pattern formed thereby
abstract The present invention relates to a method of manufacturing a mask pattern, comprising the steps of: (a) printing a mask solution on a lower surface of a transparent substrate to produce a mask pattern layer which provides an opaque region for intensified pulsed light (IPL) (b) applying a conductive solution to an upper surface of the transparent substrate to form a conductive layer, (c) irradiating intensified pulsed light (IPL) to the mask pattern layer, and (d) And a step of removing the unconsumed conductive layer and the mask pattern layer by the IPL being opaque by the mask pattern layer, thereby forming a conductive pattern using the light sintering method. The method of forming a conductive pattern according to the present invention is characterized in that IPL light is selectively transmitted through a mask pattern layer printed on a lower surface of a substrate to provide an impermeable region and a conductive layer formed on an upper surface of the substrate is patterned , The process is simplified and the continuous process can be performed as compared with the prior art in which a pattern is formed by using a mask, thereby reducing the production cost through mass production of the conductive pattern.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022250113-A1
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