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filingDate 2015-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101705975-B1
titleOfInvention Copper foil with carrier, printed circuit board, laminate, electronic device and method of manufacturing printed circuit board
abstract Provided is a copper foil on which a carrier on which a carrier is formed is provided with a carrier whose variation in peel strength before and after a heating press is satisfactorily suppressed. The copper foil having the carrier of the present invention has a carrier, an intermediate layer and an ultra-thin copper layer in this order. The rate of decrease in the tensile strength of the carrier after heating and pressing the copper foil with the carrier under the conditions of the pressure of 20 kgf / cm 2 and 220 캜 for 2 hours is 20% or less.
priorityDate 2014-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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