| abstract |
The invention relates to a bonding method for bonding a first contact surface (3) of a first substrate to a second contact surface (4) of a second substrate (2) according to the following steps, in particular the following sequence, - forming a reservoir (5) in a surface layer (6) on said first contact surface (3) - at least partially filling the reservoir (5) with a first extract or a first group of extracts, - contacting said second contact surface (4) and said first contact surface (3) to form a pre-engagement connection, - a permanent bond which is located between the first and second contact surfaces (3,4) and which is reinforced by the reaction of the first extract with the second extract contained in the reaction layer (7) of the second substrate (2) And forming the second electrode layer. |