| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_22fe92a0e431abcf93d3be2f14bf8100
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_19ae2144fa768fdeaaec3244d224f167 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
| filingDate |
2016-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b245fde4dafae45dad8c1de613ff8149
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_903ce061c5d8be98f1df3a035c95ffa4 |
| publicationDate |
2017-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101704793-B1 |
| titleOfInvention |
Printed circuit boards using the epoxy resin composition and its manufacturing method |
| abstract |
The present invention relates to a circuit board using an epoxy resin composition and a method of manufacturing the same, and more particularly, to an epoxy resin composition prepared by mixing a powder in which an epoxy resin and a carbon nanotube (CNT: Carbon Nano Tube) are dispersed in an aluminum powder To a circuit substrate using the epoxy resin composition and a method of manufacturing the same. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230059997-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102536636-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210020555-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220065560-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102432757-B1 |
| priorityDate |
2016-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |