| abstract |
The present invention relates to a polyimide silicone having, as component (A), a primary alcoholic hydroxyl group; As the component (B), at least one compound selected from the group consisting of an amino condensation product modified with formalin or formalin-alcohol and a phenol compound having an average of at least two methylol groups or alkoxymethylol groups in one molecule; And a photoacid generator as the component (C). When used as an adhesive, the photo-curable resin composition further comprises a polyfunctional epoxy compound as the component (D). |