Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31667 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31855 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31645 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31909 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-3324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-418 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G61-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-094 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G61-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
filingDate |
2010-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2017-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-101697802-B1 |
titleOfInvention |
Acid-etch resistant, protective coatings |
abstract |
Methods of using such compositions as a protective layer during the manufacture of the novel compositions and semiconductors and MEMS devices are provided. The composition comprises a cycloolefin copolymer dispersed or dissolved in a solvent system and can be used to form a layer that protects the substrate during acid etching and other processing and handling. The protective layer may be photosensitive or non-photosensitive and may be used with or without a primer layer under the protective layer. A preferred primer layer comprises a basic polymer in a solvent system. |
priorityDate |
2009-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |