| abstract |
A lead frame and a semiconductor package having the lead frame are disclosed that do not increase the thickness and the area. A semiconductor package according to the present invention comprises a die paddle having openings formed therein and having first and second edges on both sides and a plurality of leads disposed around the die paddles, The leadframe includes a first semiconductor chip mounted on the die paddles on the first surface and covering at least a portion of the opening, and a secondary semiconductor chip attached to the first semiconductor chip through the opening. |