http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101693597-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_964715652eb394808baf941c5b3eb33a |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C211-63 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C211-63 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D9-02 |
| filingDate | 2016-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_126428d2e3dcc1a77e5a50366e81f300 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95e95d21fc041ce1c18b6453a2bb236a |
| publicationDate | 2017-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101693597-B1 |
| titleOfInvention | Copper plating method using electrolytic copper plating solution including two types of leveler |
| abstract | The electrolytic copper plating method according to the present invention is an electrolytic copper plating method for forming a copper film by an electrolytic plating method on a substrate having a pattern formed thereon, Is used as the electrolytic copper plating solution. The two types of flatting agents also include a first flatting agent for convexing the surface of the copper film and a second flatting agent for concave the surface of the copper film. |
| priorityDate | 2016-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 235.