| abstract |
More particularly, the present invention relates to a composition, which contains an epoxy resin and has a viscosity of 10,000 to 30,000 cps, a thixotropic index of 0.7 to 1.0 at room temperature, and a thixotropic index of 0.4 to 0.7 at high temperatures. The adhesion and coating properties of a substrate and a solder ball can be improved by using the composition for epoxy flux paste. Also, a method for mounting a semiconductor device capable of improving process efficiency can be provided and an electronic device having excellent electrical characteristics can be manufactured. |