| abstract |
A semiconductor device includes: a first semiconductor portion including a first wiring layer on one side; A second semiconductor portion including a second wiring layer on one side; A conductive material extending through the first semiconductor portion to the second wiring layer of the second semiconductor portion; And an opening penetrating the first semiconductor portion which can be electrically connected to the second wiring layer, in addition to the opening for the conductive material, wherein the first and second semiconductor portions are formed by the first and second semiconductor portions, And the first and second wiring layers are electrically connected to each other with the conductive material being in contact with each other. |