| abstract |
(A) a polymer compound having a pyrolysis initiation temperature of 250 DEG C or higher, and (B) a radically polymerizable monomer, an adhesive support using the same, and a semiconductor device manufacturing method, (For example, 100 占 폚), it is possible to temporarily hold the member to be treated with a high adhesive force, and even in the case of temporary support under high temperature, An adhesive support for manufacturing a semiconductor device capable of easily releasing temporary support to a treated member without damaging the treated member and an adhesive support using the same, ≪ / RTI > |