| abstract |
The present invention relates to a laminate package that can be used in a three-dimensional system-in-package (SIP). The laminated package includes a first semiconductor chip, a second semiconductor chip, and a supporting member. The first semiconductor chip has a penetrating electrode. The second semiconductor chip is stacked on the upper surface of the first semiconductor chip and electrically connected to the first semiconductor chip through the penetrating electrode of the first semiconductor chip. The support member is attached on the upper surface of the first semiconductor chip away from the rim of the second semiconductor chip. |