| abstract |
According to various embodiments, a method of manufacturing a semiconductor device includes providing a semiconductor workpiece, the first side of the semiconductor workpiece including a device region, wherein the mechanical stability of the semiconductor workpiece comprises at least one back end process Depositing at least one conductive layer on a second side of the semiconductor workpiece opposite the first side of the semiconductor workpiece, wherein the at least one conductive layer comprises at least one back end process And increasing the mechanical stability of the semiconductor workpiece to be sufficient to withstand damage without damage. |