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filingDate 2013-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101652616-B1
titleOfInvention Silicon nitride powder production method, silicon nitride powder, silicon nitride sintered body and circuit substrate using same
abstract An object of the present invention is to provide a silicon nitride sintered body having high mechanical strength and thermal conductivity and a circuit board using the same. (-H) -based compound having an RS / RO of 500 or more is flowed through a continuous firing furnace while the specific surface area is RS (m 2 / g) and the oxygen content is RO (mass% And heating at a heating rate of 12 占 폚 / min to 100 占 폚 / min in a temperature range of 1400 占 폚. In addition, the content of oxygen existing 3 nm below the surface of the particle from the surface of the particle is referred to as FSO (mass%), and the content of oxygen existing inside 3 nm below the surface of the particle is referred to as FIO , A FS / FSO of 8 to 25 and a FS / FIO of 22 or more when the specific surface area is FS (m 2 / g), a silicon nitride sintered body obtained by sintering the silicon nitride powder, A circuit board using the sintered body is provided.
priorityDate 2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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