| abstract |
A method of manufacturing a semiconductor die utilizing interconnect structure includes forming a conductive element in contact with a bond pad on an active surface over a total filler diameter of the conductive element followed by the step of forming a conductive material on the conductive element, And a step of applying. The polyimide material is selectively exposed and developed to remove the photosensitive material covering at least the top portion of the conductive element. Semiconductor die and semiconductor die assemblies are also disclosed. |