http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101641031-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-208 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate | 2013-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101641031-B1 |
| titleOfInvention | Method for treating substrate that supports catalyst particles for plating processing |
| abstract | The present invention provides a method for processing a substrate for supporting metal fine particles for forming a plating layer on TSVs and various substrates, which enables fine processing and enables formation of a stable plating layer. The present invention is a method of treating a substrate in which a colloid solution containing the metal particles is brought into contact with a substrate to carry metal particles serving as catalysts for forming a plating layer on the substrate, wherein the colloid solution has a particle diameter of 0.6 nm And a Pd having an interplanar distance of not less than 2.254 angstroms on the (111) plane. With respect to the surface of the substrate before this treatment, the bonding force of the Pd particles can be increased by forming an organic layer such as SAM. |
| priorityDate | 2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.