abstract |
The present invention relates to a silver paste for the manufacture of a flexible printed circuit board and a flexible printed circuit board made therefrom comprising silver powder, polymer resin and solvent, wherein the silver powder has a grain size range of 0.1 to 4.5 μm, In comparison with the conventional method of etching a copper foil of an expensive FCCL by printing a pattern and firing at a low temperature, a flexible printed circuit board can be manufactured, thereby reducing manufacturing cost of a flexible printed circuit board and improving productivity . |