http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101639411-B1

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filingDate 2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101639411-B1
titleOfInvention Flexible printed circuit board
abstract The present invention relates to a silver paste for the manufacture of a flexible printed circuit board and a flexible printed circuit board made therefrom comprising silver powder, polymer resin and solvent, wherein the silver powder has a grain size range of 0.1 to 4.5 μm, In comparison with the conventional method of etching a copper foil of an expensive FCCL by printing a pattern and firing at a low temperature, a flexible printed circuit board can be manufactured, thereby reducing manufacturing cost of a flexible printed circuit board and improving productivity .
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230089742-A
priorityDate 2012-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 32.