| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c2e9ee0fccf47f5a8b83fbb5197e03c1 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2066 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2015-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f6c36b2c886fa2a2714f1b18b65cf8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61906e97a2b7f27bd71587cf4cba33eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4be3ab325bccd2a61c91b5e91a7af958 |
| publicationDate |
2016-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101638827-B1 |
| titleOfInvention |
Method for activating pretreatment of electroless palladium plating and composition of activating solution |
| abstract |
The present invention relates to a composition of an activating solution for pretreatment of electroless palladium plating, to form a perfectly fine metal layer of palladium on a copper surface using a stabilizing agent and a copper ion elution inhibitor. Thereby, the composition allows to continuously maintain a palladium plating rate in an electroless palladium plating bath to ensure a predefined thickness of the plating and to retain stability of the plating bath. The activating solution for pretreatment of the electroless palladium plating on the copper surface with an ultrathin circuit of line/space (20μm/20μm) provides excellent soldering properties and wire bonding properties by preventing pinhole and void between the copper surface and the palladium plating layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101883249-B1 |
| priorityDate |
2015-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |