http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101618445-B1

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
filingDate 2014-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101618445-B1
titleOfInvention Copper foil for circuit board, and circuit board
abstract [assignment] Provided is an electrolytic copper foil for a wiring board, which has both resin adhesion suitable for application to a wiring board and visibility after formation of a circuit pattern. [Solution] (D d ) of 5 to 50% and a chroma (C * ) of 50 or less at a wavelength of 600 nm on the surface of the adherend surface to which the resin of electrolytic copper is adhered. In the electrolytic copper foil for the circuit board, to the psychometric lightness (L *) of 75 or less is preferable, and it is more preferable that a total light reflectivity (R t) of a wavelength of 600nm to 10-55%.
priorityDate 2013-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 21.