| abstract |
The present invention relates to a high dielectric constant thermoplastic composition that can be used in a laser direct structured method. The composition of the present invention comprises a thermoplastic base resin, an additive for direct laser structuring, and at least one ceramic filler. These compositions provide thermoplastic compositions of high dielectric constant, low loss tangent. The compositions of the present invention can be used in a variety of applications, such as personal computers, notebook and portable computers, cellular phone antennas and other communications equipment, medical applications, RFID applications, and automotive applications. |