Predicate |
Object |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-784 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-822 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
filingDate |
2011-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2016-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2016-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-101617600-B1 |
titleOfInvention |
Coating adhesives onto dicing before grinding and micro-fabricated wafers |
abstract |
The manufacturing method of semiconductor wafers into discrete semiconductor dies uses both a dicing step prior to grinding and / or a via hole micro fabrication step, and an adhesive coating step. |
priorityDate |
2010-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |