| abstract |
An epoxy resin composition having a low melting point, a low melt viscosity, an excellent solvent solubility and processability and an excellent flowability, processability, flexibility, adhesiveness and thermal conductivity, and a cured product thereof. (I) (Q: a chain in which the straight-chain portion, which may have C1-18 alkyl on the side chain, is an alkylene chain of C1-9, an ether bond exists between two consecutive methylene groups in the alkylene chain, A: Phenylene unit, naphthylene unit, n: 0 to 10) wherein the phenylene group is bonded directly or via a connecting chain. An epoxy resin composition containing the epoxy resin and a curing agent. And a composition comprising the epoxy resin. |