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filingDate 2012-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2016-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101611108-B1
titleOfInvention Methods of forming through-substrate vias
abstract A method of forming through substrate vias includes separately electroplating at least one element different from copper and copper to fill the remaining volume of through substrate via openings formed in the substrate. The electrodeposited copper and the at least one other element are annealed to form an alloy of the copper and at least one other element used to form conductive through substrate via structures comprising an alloy.
priorityDate 2011-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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