| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49169
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1453
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1241 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2009-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101610790-B1 |
| titleOfInvention |
Metallic pastes and inks |
| abstract |
A metal composition comprising a solvent and a plurality of metal nanoparticles dispersed therein is configured to provide a metal conductor having a resistivity of about 5 x 10 < -4 > OMEGA. Cm or less by curing the metal composition on the substrate. The electrical component assembly may be interconnected by metal conductors formed by curing the metal composition on the substrate. Metal compositions comprising metal nanoparticles can be deposited and solidified on a substrate. The metal composition is contacted with the metal wire before and after solidification of the metal composition and is fixed to the solidified metal composition. |
| priorityDate |
2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |