http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101608072-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-46 |
| filingDate | 2014-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101608072-B1 |
| titleOfInvention | Tin-silver electroplating solution, producing method thereof and formation method of tin-silver solder bump using the same |
| abstract | The present invention relates to a tin-silver electroplating solution, a process for producing the same, and a method for forming tin-silver solder bumps using the same, and more particularly, to a tin- silver solder bump containing no tin- and cyanidation compounds, - is an electroplating solution, a method of making the same, and a method of forming a tin-silver solder bump using the same. To this end, the tin-silver electroplating solution according to the present invention contains a total amount of 5 to 100 g / L of divalent tin ions, monovalent ions, sulfur compounds and thioamides, 2 to 5: 1. |
| priorityDate | 2014-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 101.