http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101603023-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K23-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49883 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
| filingDate | 2012-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101603023-B1 |
| titleOfInvention | Copper particle dispersion, conductive film formation method, and circuit substrate |
| abstract | And a copper microparticle dispersion in which copper microparticles are dispersed. The copper fine particle dispersion has copper fine particles, at least one kind of dispersion medium containing the copper fine particles, and at least one dispersing agent for dispersing the copper fine particles in a dispersion medium. The copper fine particles have a central particle diameter of 1 nm or more and less than 100 nm. The dispersion medium is a polar dispersion medium. The dispersant is a compound having at least one acidic functional group and a molecular weight of 200 or more and 100000 or less, or a salt thereof. Thus, the dispersant has compatibility with the dispersion medium, and the copper microparticles are dispersed in the dispersion medium because the surface thereof is covered with the dispersant molecule. |
| priorityDate | 2011-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.