http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101595950-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C2202-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22F1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00 |
| filingDate | 2014-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101595950-B1 |
| titleOfInvention | Lead-Free Solder Alloys Containing Sulfur and Their Manufacturing Methods |
| abstract | More particularly, the present invention relates to a solder alloy containing 0.01 to 0.35 mass% of sulfur and 60 mass% or more of tin, 0.01 to 0.35 mass% of sulfur and 60 mass% or more of tin (Step 1) by heat-treating the solder alloy composition including the solder alloy composition at a temperature of 100 to 1000 캜; And (2) washing the heat-treated alloy of step 1 and then re-heat-treating the alloy at a temperature of 50 to 250 ° C (step 2). The present invention improves mechanical strength by containing sulfur in a solder alloy composition containing tin as a base material, gives high bonding reliability to electronic parts using the solder alloy, and can improve antioxidation and electrical conductivity. Sulfur-containing solder alloys have a melting point similar to that of conventional solder alloys and can therefore be processed with existing equipment. |
| priorityDate | 2014-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 102.