| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14643
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08054 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-764
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2013-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101595623-B1 |
| titleOfInvention |
A bonding pad on a back side illuminated image sensor |
| abstract |
A bonding pad structure for an image sensor device and a method of manufacturing the same are disclosed. The image sensor device has a substrate and a bonding pad region including a bonding pad structure and a light irradiation sensor region having a light irradiation detection device. The bonding pad structure comprises: an interconnect layer; Interlayer dielectric layer (IDL) - both extend into the bonding pad region from below the substrate; An isolation layer formed on the IDL; A conductive pad having at least one bridging portion extending vertically from the planar portion and the planar portion to the interconnection layer through the IDL and the isolation layer; And a plurality of nonconductive stress relief structures disposed between the isolation layer and the conductive pads in a manner adjacent to the planar and bridging portions of the conductive pads to mitigate potential pulling stresses applied and to prevent conductive pad detachment. |
| priorityDate |
2013-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |