http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101595457-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 2013-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101595457-B1 |
| titleOfInvention | New poly-amic acid, photo-sensitive resin composition, dry film, and circuit board |
| abstract | The present invention provides a novel photosensitive polyamic acid having an imidazole group introduced into a polymer chain and a photosensitive material containing the polyamic acid and satisfying excellent flexibility and low stiffness characteristics and exhibiting excellent heat resistance and resistance to water A dry film obtained from the photosensitive resin composition, and a circuit board comprising the dry film. |
| priorityDate | 2012-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 117.