http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101585305-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1536 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15331 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10674 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06568 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4682 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2012-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101585305-B1 |
| titleOfInvention | Method for producing package substrate for mounting semiconductor element, package substrate for mounting semiconductor element, and semiconductor package |
| abstract | And a method for manufacturing a package substrate for mounting a semiconductor element which can cope with high density and is excellent in reliability. A step of forming a core substrate by laminating a first carrier metal foil, a second carrier metal foil and a base metal foil on a base material and laminating the same with a base material; and a step of forming, between the first carrier metal foil and the second carrier foil, A step of physically peeling the first carrier metal foil, a step of performing a first pattern plating on the second carrier metal foil, a step of forming a laminate by forming an insulating layer, a conductor circuit and an interlayer connection on the first pattern plating A step of separating the laminate from the core substrate together with the carrier metal foil, and a method of manufacturing a package substrate for mounting a semiconductor element having a step of forming an embedding circuit or a steric circuit by etching. |
| priorityDate | 2011-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.